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High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG

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HDI Printed Circuit Boards

  • High Precision HDI Printed Circuit Boards suppliers

HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.

 

It uses the micro blind & buried vias technology with high density circuits layout on the PCB board. It's a compact PCB that is designed for small volume users. It uses the design of modular paralle capacity of 1000VA, say height of 1u, natural cooling down, and it can be placed into the rack of 19" directly, the max parallel that can be connected in is up to 6 modules. This special products uses all digital signal processing (DSP) technology and multiple patented technology, it has the ful range of adaptability to load capacity and strong short-term overload capacity, and can ignore the factor of load power and crest.

 

 

Advantages of HDI PCB can be small size, high frequency and high speed. Mainly used for PC, cellphones and digital cameras...

HDI Printed Circuit Boards Sample Introduction

High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG

China High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG Supplier
High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG Supplier High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG Supplier High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG Supplier

Large Image :  High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG

Product Details:

Place of Origin: China
Brand Name: KAZ
Certification: ISO9001, UL, RoHS
Model Number: PCB-S-HDI-001

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: 100
Packaging Details: vacuum
Delivery Time: 25~30
Supply Ability: 20000 sq.m / month
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Detailed Product Description
Layers: 12 Material: FR-4 Tg150
Min Line: 2 Mil PCB Type: HDI
Blind & Buried Via: Yes Impedance Control: Yes

This is a PCB with 12 layers, min line width and space is 2mil/2mil, specialty include impedance control, blind & buried via, BGA wtih soldmask defined, 

 

 

Detials for this 12 layers min 2 mil line width high Tg High Density Interconnect HDI PCB:

 

  • 12 layers
  • FR-4
  • Tg 150
  • ENIG surface
  • 1.6mm board thickness
  • BGA with soldmask defined
  • With inpedance control
  • With Blind & buried via

Copper Thickness:

 

L1-------------------------------1/3OZ + Plating

PP 3.00mil

L2-------------------------------1/3OZ + Plating

PP 2.35mil

L5-------------------------------1/3OZ + Plating

PP 2.97mil

L6-------------------------------1/3OZ + Plating

PP 2.51mil

L5------------------------------H OZ

0.2mm Core

L6------------------------------H OZ

PP 2.75mil

L7-------------------------------H OZ

0.2mm Core

L8-------------------------------H OZ

PP 2.64mil

L9-------------------------------1/3OZ + Plating

PP 2.83mil

L10------------------------------1/3OZ + Plating

PP 2.43mil

L11------------------------------1/3OZ + Plating

PP 3.09mil

L12------------------------------1/3OZ + Plating

 

 

More photoes for this 12 layers HDI PCB

 

High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG

 

High Density Interconnect HDI Printed Circuit Boards 12 Layers Min 2 Mil Line Width High TG

Contact Details
Shenzhen KAZ Circuit Co., Ltd

Contact Person: stacey

Tel: +8613392447006

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