What it is：
Any PCB Board with more than 2 layers can be called Multilayer PCB Board .
Multilayer PCB Board includes multi-layer etch layers and medium layers between each two etch layers.The medium layer can be very thin. There are at least three conductive layer in a multilayer circuit board , two of which are outlayers, while the remaining one is synthesized inside the insulation board.
The electrical connection between them is usually achieved through the plating hole in the cross section of the circuit board.
Classify: Multilayer rigid board, multilayer flexible board and multilayer rigid-flex board.
Why we need it:
Cause the increased concentration of integrated circuit package leading to a high concentration of interconnect lines, It makes it necessory to use the multiple substrates.
Unpredictable design issues such as noise, stray capacitance, crosstalk, etc. occur in the layout of the PCB. Therefore, the design of PCB must focus on minimizing the length of the signal line and avoiding parallel paths.
Obviously, due to the limited number of crossovers that can be achieved in a single-side, even in a double-side board, these requirements cannot be satisfied.
In the case of a large number of requirements in interconnections and crossovers, to achieve a satisfactory performance, the board must be expanded to more than two layers, so a multilayer PCB board is manufactured.
Payment & Shipping Terms:
|Board Thickness:||1.6mm||Copper:||0.5 Oz|
|Surface:||HASL LF||Size:||204*176mm / 2UP|
This is 4 Layers FR-4 HASL Rigid PCB Circuit Board Green Soldmask With Blind Via multilayer PCB
PCB size: 204*176mm / 2UP, IPC Class 2 quality standard.
More photoes for 4 Layers FR-4 HASL Rigid PCB Circuit Board Green Soldmask With Blind Via multilayer PCB
Manufacturing Capacity - Rigid PCB
|Type of Products||Single Sided, double sided & multilayer|
|Max Board Size||Single & Double Sided: 600*1500mm|
|Multilayer: 600*1,200 mm|
|Surface Finish||HASL, ENIG, OSP, Immersion Silver, Golden Finger, etc.|
|Base Copper||18um(1/2oz), 35um (1oz), 70um (2oz), 105um (3oz), 150um (4oz), 300um (8oz)|
|Board Material||FR-4, Aluminum base, Polymide, copper base, ceramic base|
|Min Drilling Hole Size||0.1mm|
|Min Line Width & Space||0.075mm|
|Platting Gold||Nickle Plating Thickness 2.5~5um, gold thickness 0.05~0.1um|
|Tin Spraying||Tin thickness 2.5~5um|
|Milling Space||wire & edge: 0.15mm, hole & edge: 0.2mm, Contour Tolerance: +/-0.1mm|
|Socket Chamfer||Angle: 30°/45°/60° Depth: 1~3mm|
|V-Cut||Angle: 30°/45°/60° Depth: 1/3 of board thickness, min aise: 80*80mm|
|On-Off Test||Max Testing Area: 400*1,200mm|
|Max Testing Point: 12,000 points|
|Max Testing Voltage: 300V|
|Max Insulation Resistance: 100mΩ|
|Impedance Control Tolerance||± 10%|
|Soldering Endurance||85℃~105℃ / 280℃~360℃|
Manufacturing Equipments - Rigid PCB
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