 |
|
Introduction:
SMT PCB Assembly means Surface Mount Technology, known as a a kind of Circuit assembly technology that installs the SMC/SMD (named Chip Components in Chinese) on the surface of Printed Circuit Board or on the surface of other substrates, which is solded and assembled by means of reflow soldering or dip soldering. It realizes high density, high reliability, miniaturization and low cost of electronic product assembly.
Characterictics:
1. High density, small size, low weight;
2. Reliable, strong earthquake resistance and low defect rate of soldering spot;
3. High frequency, reducting the interference of electromagnetism and radio frequency;
4. Easy to realize automation and improve production efficiency.
Product Details:
Payment & Shipping Terms:
|
| Layers: | 2 Layers | Board Thickness: | 1.6mm |
|---|---|---|---|
| Copper: | 1oz | Surface: | HASL LF |
| Soldmask: | Green | Silk Screen: | White |
quick turnaround time lead-free soldering RoHS compliance SMT PCB Assembly
Detail Specifications:
| Layers | 2 |
| Material | FR-4 |
| Board Thickness | 1.6mm |
| Copper Thickness | 1oz |
| Surface Treatment | HASL LF |
| Soldmask & Silkscreen | Green & White |
| Quality Standard | IPC Class 2, 100% E-testing |
| Certificates | TS16949, ISO9001, UL, RoHS |
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
SMT Capacity
The quick turnaround time lead-free soldering RoHS compliance SMT PCB assembly process typically involves the following steps:
Design: The PCB is designed using computer-aided design (CAD) software.
Fabrication: The PCB is fabricated using a process called photolithography.
Solder paste application: Lead-free solder paste is applied to the PCB at the locations where the components will be placed.
Component placement: SMT components are placed on the PCB using a pick-and-place machine.
Reflow soldering: The PCB is passed through a reflow oven, which heats the solder paste and reflows it, forming solder joints between the components and the PCB.
Inspection: The PCB is inspected to ensure that all components are properly placed and soldered.
Benefits of using SMT for quick turnaround time lead-free soldering RoHS compliance PCB assembly:
Speed: SMT assembly is a fast process, making it ideal for quick turnaround time PCB assembly.
Reliability: SMT is a highly reliable assembly process, making it suitable for RoHS compliance.
Cost-effectiveness: SMT assembly is a cost-effective option for PCB assembly.
Photoes of quick turnaround time lead-free soldering RoHS compliance SMT PCB Assembly
Contact Person: Stacey Zhao
Tel: +86 13392447006
Fax: 86-755-85258059
