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Hdi Pcb Blind Holes Impedance Control BGA

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HDI Printed Circuit Boards

  • High Precision HDI Printed Circuit Boards suppliers

HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.

 

It uses the micro blind & buried vias technology with high density circuits layout on the PCB board. It's a compact PCB that is designed for small volume users. It uses the design of modular paralle capacity of 1000VA, say height of 1u, natural cooling down, and it can be placed into the rack of 19" directly, the max parallel that can be connected in is up to 6 modules. This special products uses all digital signal processing (DSP) technology and multiple patented technology, it has the ful range of adaptability to load capacity and strong short-term overload capacity, and can ignore the factor of load power and crest.

 

 

Advantages of HDI PCB can be small size, high frequency and high speed. Mainly used for PC, cellphones and digital cameras...

HDI Printed Circuit Boards Sample Introduction

Hdi Pcb Blind Holes Impedance Control BGA

China Hdi Pcb Blind Holes Impedance Control BGA Supplier

Large Image :  Hdi Pcb Blind Holes Impedance Control BGA

Product Details:

Place of Origin: China
Brand Name: KAZPCB
Certification: UL, ROHS, REACH, TS16949
Model Number: PCB-HDI-003

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: To be Inquired
Delivery Time: 15-18days
Payment Terms: T/T, L/C
Supply Ability: 10000pcs/month
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Detailed Product Description
PCB Material: FR4 Spec: As Per Customer Gerber Files

PCB board
Layer: 1-16
Material: FR4 laminate, RoHS Directive-compliant
PCB thickness: 0.4-6.0mm
Final copper: 0.5-6oz
Min hole: 0.1mm
Min line width/space: 3/3 mil
Min hole copper: 20/25µm
Solder masks: green/blue/red/black/gray/white
Legend: white/black/yellow
Surface: OSP/HAL lead-free/immersion gold/immersion tin/immersion silver/flash gold/hard gold
Outline: rout and score/V-cut
E-test: 100%
Inspection standard: IPC-A-600H/IPC-6012B, class 2/3
Outgoing reports: final inspection, e-test, solderability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant, ISO/TS16949:2009

 

Manufacturer Capacity:
 

Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~20 layers
Material FR-4, Aluminum, PI
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP

 

Hdi Pcb Blind Holes Impedance Control BGA

Contact Details
Shenzhen KAZ Circuit Co., Ltd

Contact Person: Rita02

Tel: +8613420127062

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