HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.
It uses the micro blind & buried vias technology with high density circuits layout on the PCB board. It's a compact PCB that is designed for small volume users. It uses the design of modular paralle capacity of 1000VA, say height of 1u, natural cooling down, and it can be placed into the rack of 19" directly, the max parallel that can be connected in is up to 6 modules. This special products uses all digital signal processing (DSP) technology and multiple patented technology, it has the ful range of adaptability to load capacity and strong short-term overload capacity, and can ignore the factor of load power and crest.
Advantages of HDI PCB can be small size, high frequency and high speed. Mainly used for PC, cellphones and digital cameras...
Payment & Shipping Terms:
|PCB Material:||FR4||Spec:||As Per Customer Gerber Files|
Material: FR4 laminate, RoHS Directive-compliant
PCB thickness: 0.4-6.0mm
Final copper: 0.5-6oz
Min hole: 0.1mm
Min line width/space: 3/3 mil
Min hole copper: 20/25µm
Solder masks: green/blue/red/black/gray/white
Surface: OSP/HAL lead-free/immersion gold/immersion tin/immersion silver/flash gold/hard gold
Outline: rout and score/V-cut
Inspection standard: IPC-A-600H/IPC-6012B, class 2/3
Outgoing reports: final inspection, e-test, solderability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant, ISO/TS16949:2009
|Capacity||Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
|Min Line Width/Gap||4/4 mil (1mil=0.0254mm)|
|Material||FR-4, Aluminum, PI|
|Max PCB Size||600*1200mm|
|Min Hole Size||0.2mm (+/- 0.025)|
|Surface Treatment||HASL, ENIG, OSP|