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Shenzhen KAZ Circuit Co., Ltd

 

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HDI Printed Circuit Boards Blind Via PCB Burried Vias Impedance Control BGA Gold Finger

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Good quality SMT PCB Assembly
Good quality SMT PCB Assembly
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End customers were satisfied with the quality, so did I for the past years. Have recommended you to my other friends that have needs in PCBA.

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Thanks for help my small business grows up step by step,for prototypes to small, medium & large orders, you will be my first choice for PCB anytime.

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Good price, fast lead and delivery time, shipping cost is quite good! Our company is satisfied with your good service for the last 4 years!

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HDI Printed Circuit Boards

  • High Precision HDI Printed Circuit Boards suppliers

HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.

 

It uses the micro blind & buried vias technology with high density circuits layout on the PCB board. It's a compact PCB that is designed for small volume users. It uses the design of modular paralle capacity of 1000VA, say height of 1u, natural cooling down, and it can be placed into the rack of 19" directly, the max parallel that can be connected in is up to 6 modules. This special products uses all digital signal processing (DSP) technology and multiple patented technology, it has the ful range of adaptability to load capacity and strong short-term overload capacity, and can ignore the factor of load power and crest.

 

 

Advantages of HDI PCB can be small size, high frequency and high speed. Mainly used for PC, cellphones and digital cameras...

HDI Printed Circuit Boards Blind Via PCB Burried Vias Impedance Control BGA Gold Finger

HDI Printed Circuit Boards Blind Via PCB Burried Vias Impedance Control BGA Gold Finger
HDI Printed Circuit Boards Blind Via PCB Burried Vias Impedance Control BGA Gold Finger

Large Image :  HDI Printed Circuit Boards Blind Via PCB Burried Vias Impedance Control BGA Gold Finger

Product Details:

Place of Origin: Shenzhen China
Brand Name: KAZPCB
Certification: IATF16949-2016 | ISO9001 2015 | UL 337072 | ROHS
Model Number: PCB-HDI-116

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: To be Inquired
Packaging Details: Vacuum bag
Delivery Time: 12-15days
Payment Terms: T/T, L/C
Supply Ability: 10000pcs/month
Detailed Product Description
PCB Material: FR4 Size: As Per Gerber
Thickness: 0.8-3.2mm Layers: 4-10layers
Copper: 1-6OZ Surface: ENIG/HASL/OSP
Soldermask: Red/Green/Black/White Standard: IPC Class 2
Silkscreen: White/Black/Red/Green Impedance Control: Yes
Gold Finger: Yes
High Light:

blind via pcb

,

lead free pcb

4-10 layers FR4 1OZ ENIG/HASL/OSP HDI Printed Circuit Boards With Blind&Burried holes
Detail Specifications:

 

Layers 4-10Layers
Material FR-4
Board Thickness 1.6mm
Copper Thickness 1-6oz
Surface Treatment ENIG/HASL/OSP
Soldmask & Silkscreen Green & White & Red & Green
Quality Standard IPC Class 2, 100% E-testing
Certificates

IATF16949-2016 | ISO9001 2015 | UL 337072 | ROHS


Photoes of this 4-10 layers FR4 1OZ ENIG/HASL/OSP HDI Printed Circuit Boards With Blind&Burried holes
HDI Printed Circuit Boards Blind Via PCB Burried Vias Impedance Control BGA Gold Finger HDI Printed Circuit Boards Blind Via PCB Burried Vias Impedance Control BGA Gold Finger HDI Printed Circuit Boards Blind Via PCB Burried Vias Impedance Control BGA Gold Finger
What KAZ Circuit can do for you:

  • PCB manufacturing (prototype, small to medium, mass production)
  • Components Sourcing
  • PCB Assembly/SMT/DIP


To get a full quotation of the PCB/PCBA, pls provide the information as below:

  • Gerber File, with detail specification of the PCB
  • BOM List (Better with excel fomart)
  • Photoes of the PCBA (If you have done this PCBA before)


Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
 

Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~20 layers
Material FR-4, Aluminum, PI
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP
Impedance Control Yes
Gold Finger Yes

 

Contact Details
Shenzhen KAZ Circuit Co., Ltd

Contact Person: Stacey Zhao

Tel: +86 13392447006

Fax: 86-755-85258059

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