 |
|
Introduction of Printed Circuit Board Assembly：
Printed Circuit Board Assembly is to plug the SMT(Surface Mounted Technolofy) and the DIP in the Printed Circuit Board, also called PCBA.
Production for Printed Circuit Board Assembly：
Both SMT and DIP are means of integrating components in the PCB board. The main difference is that SMT does not need to drill holes on the PCB,while it's nacessary for the DIP to plug the pin of the component into the drilled hole.
SMT for Printed Circuit Board Assembly:
Mainly use the paste to pack machine to attach some micro components the PCB board. The production process is as follows: the PCB board positioning, solder paste printing, paste and pack, return to the soldering stove, finally inspection.
With the development of science and technology,SMT can also be applied to some large-size components.
DIP for Printed Circuit Board Assembly:
Insert the componets to the PCB. It is used as a mean to integrate components cause the size is too large to paste and pack, or the manufacturer's production process cannot use SMT technology.
At present, there are two ways to realize manual plug-in and robot plug-in.
The main production processes are as follows: paste back glue (to prevent tin plating to inappropriate places), plug-in, inspection, wave soldering, brush plate (to remove the stain left in the process of passing the furnace) and inspection
printed circuit board manufacturers， pcb assembly shenzhen, pcb factory in China
Product Details:
Payment & Shipping Terms:
|
| Layer Count: | 2 ` 30 Layers | Max Board Size: | 600 Mm X 1200 Mm |
|---|---|---|---|
| Base Material For PCB: | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material | Rang Of Finish Baords Thickness: | 0.21-7.0mm |
| Minimum Line Width: | 3mil (0.075mm) | Minimum Line Space: | 3mil (0.075mm) |
| Minimum Hole Diameter: | 0.10 Mm | Finishing Treatment: | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, Etc. |
| Thickness Of Copper: | 0.5-14oz (18-490um) | E-Testing: | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| Highlight: | fr4 printed circuit board,multilayer circuit board |
||
HDI Bluetooth control Green Soldmask White Silkscreen PCB Assembly
1. Features of Bluetooth PCBA
• Material: FR4 Tg180, 6-layer
• Minimum trace/space: 0.1mm
• Blind and buries via and via in pad
Material: FR4, high Tg
RoHS Directive-compliant
Board thickness: 0.4-5.0 mm +/-10%
Layer count: 1-22 layers
Copper weight: 0.5-5oz
Min finish hole side: 8 mils
Laser drill: 4 mils
Min trace width/space: 4/4 mils (production), 3/3 mils (sample run)
Solder mask: green, blue, white, black, blue and yellow
Legend: white, black and yellow
Max board dimensions: 18*2 inches
Finish type options: gold, silver, tin, hard gold, HASL, LF HASL
Inspection standard: ipc-A-600H/IPC-6012B, class 2/3
Electronic test: 100%
Report: final inspection, E-test, solder ability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant , ISO 9001:2008, ISO/TS16949:2009
2. Bluetooth PCBA capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
3. Bluetooth PCBA Pictures
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059
