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1. Introduction
The assembly of the printing plate is based on the requirements of the design documents and process specifications, and the electronic components are inserted into the printed circuit board according to a certain regularity, and the assembly process is fixed by fasteners or soldering.
2.Specification
| Type | SMT |
| Base material | Copper |
| Flame retardant properties | VO |
| Item number | PCB Manufacturer |
| Brand | PCBA circuit board electronic component assembly |
| Layer | 2 |
| Customized | Yes |
| Processing technology | Electrolytic foil |
3. Application
PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology. However, multilayer PCBs make repair, analysis, and field modification of circuits much more difficult and usually impractical.
Product Details:
Payment & Shipping Terms:
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| Layer Count: | 2 ` 30 Layers | Max Board Size: | 600 Mm X 1200 Mm |
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| Base Material For PCB: | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material | Rang Of Finish Baords Thickness: | 0.21-7.0mm |
| Minimum Line Width: | 3mil (0.075mm) | Minimum Line Space: | 3mil (0.075mm) |
| Minimum Hole Diameter: | 0.10 Mm | Finishing Treatment: | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, Etc. |
| Thickness Of Copper: | 0.5-14oz (18-490um) | E-Testing: | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| High Light: | electronic pcb assembly,pcb prototype assembly |
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Electronic Circuit Board PCB assembly
1. Features of Switch PCB
• Material: FR4 Tg180, 6-layer
• Minimum trace/space: 0.1mm
• Blind and buries via and via in pad
Material: FR4, high Tg
RoHS Directive-compliant
Board thickness: 0.4-5.0 mm +/-10%
Layer count: 1-22 layers
Copper weight: 0.5-5oz
Min finish hole side: 8 mils
Laser drill: 4 mils
Min trace width/space: 4/4 mils (production), 3/3 mils (sample run)
Solder mask: green, blue, white, black, blue and yellow
Legend: white, black and yellow
Max board dimensions: 18*2 inches
Finish type options: gold, silver, tin, hard gold, HASL, LF HASL
Inspection standard: ipc-A-600H/IPC-6012B, class 2/3
Electronic test: 100%
Report: final inspection, E-test, solder ability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant , ISO 9001:2008, ISO/TS16949:2009
2. Switch PCB capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
2. PCB Pictures
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059
