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1. Introduction
A printed circuit board is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called a "printing" circuit board.
2. Specification
| Material | FR4; Megtron; Arlon; Nelco |
| Layer | 2-20L |
| Copper | 0.5-3oz |
| Surface Treatment | HASL;ENIG |
| Soldermask | Black; Red; Green;White |
| Silkscreen | White, Black |
| Board Thickness | 1.6mm |
3.Process
Opening ------ Inner layer ----- lamination----drilling---sinking copper----line--- diagram electric----etching-----resistance welding ---character----spray tin (or immersion gold)-锣 edge-v cut (part of the PCB is not needed)-----fly test----vacuum packaging
4. Characteristics
PCBs are becoming more widely used because they have many unique advantages, as outlined below.
Can be high density. For decades, the high density of printed boards has grown with the integration of integrated circuits and advances in mounting technology.
1.High reliability. Through a series of inspections, tests and aging tests, the PCB can be reliably operated for a long period of time (usually 20 years).
Designability. For the various performances of PCB (electrical, physical, chemical, mechanical, etc.), the design of printed boards can be realized through design standardization and standardization, with short time and high efficiency.
2.Productivity. With modern management, it can standardize, scale (quantify), automate and other production, and ensure product quality consistency.
3.Testability. Established relatively complete test methods, test standards, various test equipment and instruments to detect and identify PCB product qualification and service life.
4. Assemblyability. PCB products not only facilitate the standardized assembly of various components, but also can be automated, large-scale mass production. At the same time, the PCB and various component assembly components can be assembled to form larger components and systems up to the complete machine.
5. Maintainability. Since PCB products and various component assembly components are produced in a standardized design and scale, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, conveniently and flexibly, and the system can be quickly restored. Of course, you can say more about it. Such as miniaturization and weight reduction of the system, high-speed signal transmission, and the like.
Product Details:
Payment & Shipping Terms:
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| Product Name: | Multilayer Sided PCB | Board Material: | Standard FR-4 |
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| Surface Treatment: | Immersion Gold | Board Thickness: | 1.6mm |
| Copper Thickness: | 1oz | Soldermask: | Blue |
| High Light: | electronics circuit board,rigid flex circuit board |
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Multilayer Sided Printed Circuit Boards , Rigid Flex Circuit pcba Board Standard FR-4,Electronic Printed Circuit Board
Bried description
Our PCB technology capacity includes 1 to 50 layers, minimum dill hole size of 0.1mm, minimum track/line size of 0.075mm, surface treatment of OSP, HAL, HASL, ENIG, Gold Finger and more. We can make our production capacity of 10,000-20,000 square meters/month for double sides and 8,000-12,000square meters/month for multilayer.
We have over 300 employees and 8,000 square meters building area. Our products include Normal Tg FR4, High Tg FR4, PTFE, Rogers, Low Dk/Df, FPC, Rigid-Flex PCB and Aluminum, Copper base PCB, etc. Assembly service including SMT, DIP with six assembly lines.
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Detailed specification
| Layer count | Single sided, double sided and multilayer to 50 layers. |
| Base material | FR-4, High Tg FR-4, Aluminum Base, Copper Base, CEM-1, CEM-3 and so on |
| Board thickness | 0.6-3mm or thinner |
| Copper thickness | 0.5-6oz or thicker |
| surface treatment | HASL, Immersion Gold(ENIG), Immersion Silver, Immersion Tin, Plating Gold and Gold finger. |
| Soldmask | Green, Blue, Black, Matte Green , White and Red |
| Silkscreen | Black and white |
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Electronic printed circuit board (PCB) manufacturing processes:
PCB material choice:
Common base materials include FR-4 (fiberglass), polyimide and ceramics
Consider properties such as dielectric constant, thermal performance, and flexibility
Special materials available for high-frequency, high-power or flexible PCBs
Copper thickness and layer count:
Typical copper foil thickness ranges from 1oz to 4oz (35µm to 140µm)
Single-sided, double-sided and multilayer PCBs available
Additional copper layers improve power distribution, heat dissipation and signal integrity
Surface Treatment:
HASL (Hot Air Solder Leveling) - Affordable, but surface may not be flat
ENIG (Electroless Nickel Immersion Gold) – provides excellent solderability and corrosion resistance
Immersion Silver - Cost effective for lead-free soldering
Additional options include ENEPIG, OSP and direct gold plating
Advanced PCB Technologies:
Blind and Buried Vias for High Density Interconnects
Microvia Technology for Ultra-Fine Pitch and Miniaturization
Rigid-flex PCBs for applications that require flexibility
High frequencies and high speeds with controlled impedance pc
PCB manufacturing technology:
Subtractive process (most common) - etching away unwanted copper
Additive process - creating copper traces on the base material
Semi-additive process - combining subtractive and additive technologies
Design for Manufacturer (DFM):
Adherence to PCB design guidelines for reliable manufacturing
Considerations include trace width/spacing, via size and component location
Close collaboration between designers and manufacturers is essential
QA and testing:
Electrical testing (e.g., online testing, functional testing)
Mechanical testing (e.g., bending, shock, vibration)
Environmental testing (e.g., temperature, humidity, thermal cycles)
3.More photos
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059
