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What it is：
Any PCB Board with more than 2 layers can be called Multilayer PCB Board .
Multilayer PCB Board includes multi-layer etch layers and medium layers between each two etch layers.The medium layer can be very thin. There are at least three conductive layer in a multilayer circuit board , two of which are outlayers, while the remaining one is synthesized inside the insulation board.
The electrical connection between them is usually achieved through the plating hole in the cross section of the circuit board.
Classify: Multilayer rigid board, multilayer flexible board and multilayer rigid-flex board.
Why we need it:
Cause the increased concentration of integrated circuit package leading to a high concentration of interconnect lines, It makes it necessory to use the multiple substrates.
Unpredictable design issues such as noise, stray capacitance, crosstalk, etc. occur in the layout of the PCB. Therefore, the design of PCB must focus on minimizing the length of the signal line and avoiding parallel paths.
Obviously, due to the limited number of crossovers that can be achieved in a single-side, even in a double-side board, these requirements cannot be satisfied.
In the case of a large number of requirements in interconnections and crossovers, to achieve a satisfactory performance, the board must be expanded to more than two layers, so a multilayer PCB board is manufactured.
Product Details:
Payment & Shipping Terms:
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| Material: | FR-4 | Layers: | 2L |
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| Board Thickness: | 1.6mm | Copper Thickness: | 1/1oz |
| Surface Treatment: | HASl | Soldmask: | Green |
| High Light: | rigid flex pcb,pcb printed circuit board |
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Regid Flexible Multilayer Fr4Green Soldermask Printed Circuit Boards ,pcb factory
Detail specification about Regid Flexible Multilayer FR4 Green Soldermask Printed Circuit Board
| Categary | Regid-Flexible PCB |
| Layers | 2L |
| Material | FR-4 |
| Surface treatment | HASL |
| Board thickness | 1.6mm |
| Soldermask | Green |
| Quality standard | IPC Class 2, 100% E-testing |
| Certificates | TS16949, ISO9001, UL, RoHS |
Brief introduction about Shenzhen KAZ Circuit Co,. Ltd.
Brief introduction
Shenzhen KAZ Circuit Co., Ltd, found in 2007, is a PCB and PCBA custom-made manufacturer. It's commitment to high precision single, double-sided, multilayer printed circuit board and metal substrate circuit board production,which is a hightech enterprises including amnufacture, sales, service and so on.
We are confident to provide you quality products with factory-directed price within the fastest delivery time!
What KAZ Circuit can do for you:
Prompt delivery: 2L: 3-5days
4L: 5-7days
24h/48h: urgent order
Company size: About 300 employees
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Multilayer PCB
Multilayer PCB is a printed circuit board made of more than two layers of copper foil. It consists of an inner copper foil, an insulating substrate and an outer copper foil, and the interconnection between the layers is achieved by drilling and copper plating. Compared with single-layer or double-layer PCBs, multilayer PCBs can achieve higher wiring density and complex circuit design.
Advantages of multi-layer PCBs:
Higher wiring density and complex circuit design capabilities
Better electromagnetic compatibility and signal integrity
Shorter signal transmission paths, improved circuit performance
Higher reliability and mechanical strength
More flexible power and ground distribution
Composition of multi-layer PCBs:
Inner copper foil: Provides conductive layer and wiring
Insulating substrate (FR-4, high-frequency low-loss dielectric, etc.): Isolates and supports each copper foil layer
Outer copper foil: Provides surface wiring and interface
Perforated metallization: Realizes electrical connection between layers
Surface treatment: HASL, ENIG, OSP and other surface treatment processes
Design and manufacture of multi-layer PCBs:
Circuit design: Signal integrity, power/ground integrity design of multi-layer boards
Layout and wiring: Reasonable layer allocation and routing optimization
Process design: Aperture size, layer spacing, copper foil thickness, etc.
Manufacturing process: Lamination, drilling, copper plating, etching, surface treatment, etc.
More photos
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059
