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HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.
This is a circuit board that uses micro-blind buried hole technology, with very high line density and complexity, and can achieve high-speed signal transmission and reliability design. The main features of HDI circuit boards are multi-layer lines, thin plates, small apertures, dense wiring and fine lines, and are widely used in mobile phones, computers, network communications, automotive electronics and other fields.
The manufacture of HDI circuit boards is one of the fastest-growing areas in the printed circuit board industry. It is a compact product designed for small-capacity users. As electronic products develop towards high density and high precision, HDI circuit boards have put forward the same requirements accordingly. The production of HDI boards uses advanced fine line production technology, so that the line width and spacing reach the micron level. This high-precision line layout not only improves the performance of the circuit board, but also reduces energy consumption and electromagnetic interference. Therefore, HDI circuit boards are widely used in high-end electronic devices such as smartphones, tablets, and laptops.
In the manufacturing process of HDI circuit boards, the process of drilling and metallization in the holes is used to achieve the connection function between the lines of each layer. Compared with traditional multi-layer circuit boards, HDI circuit boards adopt the build-up method, use blind and buried vias to reduce the number of through holes, save the PCB wiring area, and thus greatly increase the density of components. Therefore, they have quickly replaced the original multi-layer boards in the use of smart phones. With the continuous advancement of electronic technology, electronic products continue to develop in the direction of light, thin, short and small, and high-density interconnect (HDI) technology has come into being.
Product Details:
Payment & Shipping Terms:
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| Production Name: | OEM | Components: | Qualified |
|---|---|---|---|
| SMT DIP: | Support | Type: | HDI Print Circuit Board |
| Material: | Shenyi FR4 | ||
| Highlight: | blind via pcb,hdi pcb |
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Features Of Mulitiplelayers FR4 ENIG 1u' HDI Prototype Electronic Printed Circuit Boards PCB factory,Shenyi FR4,Support SMT DIP
1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available
Detailed Specifications of the board
| Material | Shengyi FR4 |
| The min hole | 0.15mm |
| Layer | 6 |
| Silkscreen | White |
| Soldermask | Green |
| Surface Treatment | ENIG 1u' |
| The finish board thickness | 1.6mm |
| The finish copper thickness | 1 oz |
What KAZ Circuit can do for you:
PCB manufacturing (prototype, small to medium, mass production)
Components Sourcing
PCB Assembly/SMT/DIP
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Gerber File, with detail specification of the PCB
BOM List (Better with excel fomart)
Photoes of the PCBA (If you have done this PCBA before)
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
HDI printed circuit boards, also known as microvia or μvia PCBs, are an advanced PCB technology that enable high-density interconnections and miniaturized electronic components.
Key features and functions of HDI printed circuit boards include:
Miniaturization and increased density:
HDI PCBs feature smaller, more closely spaced vias and vias, allowing for higher interconnect density.
This makes it possible to design more compact, space-saving electronic devices and components.
Microvias and Stacked Vias:
HDI PCBs use microvias, which are smaller, laser-drilled holes that are used to connect different layers of the PCB.
Stacked vias, where multiple vias are stacked vertically, can further increase interconnect density.
Multi-layer structure:
HDI PCBs can have a higher layer count than traditional PCBs, typically 4 to 10 or more.
The increased number of layers allows for more complex routing and more connections between components.
Advanced materials and processes:
HDI PCBs often use specialized materials such as thin copper foil, high-performance laminates, and advanced plating techniques.
These materials and processes enable the creation of smaller, more reliable, higher-performance interconnects.
Improved electrical properties:
The reduced trace widths, shorter signal paths, and tighter tolerances of HDI PCBs help improve electrical performance, including improved signal integrity, reduced crosstalk, and faster data transmission.
Reliability & Manufacturability:
HDI PCBs are designed for high reliability, with features like improved thermal management and enhanced mechanical stability.
Manufacturing processes for HDI PCBs, such as laser drilling and advanced plating techniques, require specialized equipment and expertise.
HDI printed circuit board applications include:
Smartphones, Tablets, and Other Mobile Devices
Wearable Electronics and IoT (Internet of Things) Devices
Automotive electronics and advanced driver assistance systems (ADAS)
High speed computing and telecommunications equipment
Military and aerospace electronic equipment
Medical devices and instruments
The continued demand for miniaturization, enhanced functionality, and higher performance in a variety of electronic products and systems has driven the adoption of HDI PCB technology.
More photoes
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059
