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FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

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Good quality SMT PCB Assembly
Good quality SMT PCB Assembly
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We are very satisfied wtih you guys. Quick response, professional engineering team, fast delivery, good quality... all are nice. I am sure we can have much more business in the future.

—— Kevin Kinder

End customers were satisfied with the quality, so did I for the past years. Have recommended you to my other friends that have needs in PCBA.

—— Mariusz Sharp

Thanks for help my small business grows up step by step,for prototypes to small, medium & large orders, you will be my first choice for PCB anytime.

—— Adam Burridge

Good price, fast lead and delivery time, shipping cost is quite good! Our company is satisfied with your good service for the last 4 years!

—— Luboš Herceghová

Hello good afternoon. I received the 80 pcs PCB. Thank you. I like so much that. That is good qualtiy, nice color. Pls take care of the remaining 80 pcs PCB. Thank you. Have a nice day. :)

—— Alice Yoon

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SMT PCB Assembly

  • High Precision SMT PCB Assembly suppliers
  • High Precision SMT PCB Assembly suppliers

Introduction:

SMT PCB Assembly means Surface Mount Technology, known as a a kind of Circuit assembly technology that installs the SMC/SMD (named Chip Components in Chinese) on the surface of Printed Circuit Board or on the surface of other substrates, which is solded and assembled by means of reflow soldering or dip soldering. It realizes high density, high reliability, miniaturization and low cost of electronic product assembly.

 

Characterictics:

1. High density, small size, low weight;

2. Reliable, strong earthquake resistance and low defect rate of soldering spot;

3. High frequency, reducting the interference of electromagnetism and radio frequency;

4. Easy to realize automation and improve production efficiency.

FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask
FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

Large Image :  FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

Product Details:

Place of Origin: Shenzhen China
Brand Name: NA
Certification: IATF16949-2016 | ISO9001 2015 | UL 337072 | ROHS
Model Number: NA

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: 0.1usd
Packaging Details: Anti-static bag
Delivery Time: 5-8days
Payment Terms: D/A, D/P, T/T
Supply Ability: 1000000pcs per month
Detailed Product Description
Layer Counts: 4L Materials: FR4 TG130
Surface Treatment: ENIG Board Thickness: 1.6
Solder Mask: Green Silkscreen: White
Finished Copper Thickness: 1/1/1/1oz
High Light:

FR4 ENIG SMT PCB Assembly

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BGA POP SMT PCB Assembly

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1OZ Printed Circuit Board Assembly

Detailed Informations:

 

4 Layers FR4 PCB, Electronic Circuit Board Assembly& Multilayer-PCBA Assembly

 

1. Features

1. Surface Mount PCB assembly (Both rigid PCB, flexible PCB);FR4 Material, Meet 94V0 standard
2. One Stop OEM Service,&PCBA contract manufacturing:
3. Electronic contract manufacturing service
4. Through hole assembly/DIP assembly;
5. Bonding assembly;
6. Final assembly;
7. Full Turnkey Box Build
8. Mechanical / electrical assembly
9. Supply Chain Management/Components procurement
10. PCB fabrication;
11. Technical support/ ODM service

12. Surface treament:OSP, ENIG,Lead Free HASL, Environmental Protection

13. UL, CE, ROHS Compliant

14. Shipping By DHL,UPS, TNT, EMS or Customer requirement

15. Anti-static bag

2. PCBA Technical capability

 

SMT Position accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-Solder Max. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-Solder Metal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Press-fit Press range:0-50KN
Max. PCB size:800X600mm
Testing ICT,Probe flying,burn-in,function test,temperature cycling

 

 

2. PCBA Pictures

FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

FR4 ENIG SMT PCB Assembly BGA POP 4 Layer 1.6mm 1OZ Green Soldermask

Contact Details
Shenzhen KAZ Circuit Co., Ltd

Contact Person: Jesson

Tel: 8613570891588

Fax: 86-755-85258059

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