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Introduction:
What's a SMT PCB Assembly?
SMT PCB Assembly means Surface Mount Technology, known as a a kind of Circuit assembly technology that installs the SMC/SMD (named Chip Components in Chinese) on the surface of Printed Circuit Board or on the surface of other substrates, which is solded and assembled by means of reflow soldering or dip soldering. It realizes high density, high reliability, miniaturization and low cost of electronic product assembly.
Ⅰ. The role of SMT PCB assembly
SMT PCB assembly, referred to as PCBA, is to install components and perform soldering on a printed circuit board (PCB) to form a fully functional circuit board. PCBA can achieve the connection and control between different components and devices, and undertake the task of information transmission and processing. Therefore, circuit board assembly is widely used in electronic product manufacturing, communication equipment, instrumentation, automotive electronics, medical equipment and other fields.
Ⅱ. The process of SMT PCB assembly
Circuit board assembly includes multiple links such as component procurement, PCB production, component mounting, wave soldering, and functional testing. The specific process is as follows:
1. Component procurement. Select and purchase components according to the BOM table to ensure the accuracy of component quality and quantity.
2. PCB production. Design PCB according to the circuit schematic and layout diagram, and then make the circuit board through printing process.
3. Component mounting. Use a chip mounter to stick components on the circuit board. This is the most complex and technology-intensive link in the whole process.
4. Wave soldering. Wave solder the soldered components and circuit boards to ensure that the connection between components and PCB is firm and reliable.
5. Functional test. Perform functional test on the circuit board to verify whether the performance of the circuit board meets the expected target. If there is a problem, the entire process needs to be reworked and debugged.
Ⅲ.Precautions for SMT PCB assembly
1. SMT PCB assembly requires the use of some special equipment and tools, such as placement machines, ovens, wave soldering machines, etc. Therefore, it should be carried out in a professional PCBA manufacturer or factory.
2. Before assembling the circuit board, you need to prepare relevant materials such as BOM table, circuit schematic, PCB layout diagram, component information, etc.
3. The quality and packaging method of components have a great impact on the quality and performance of the circuit board. According to the circuit requirements, appropriate components should be selected for assembly.
4. Before assembling the circuit board, it is necessary to check whether the quality and quantity of the components are complete.
5. When soldering components, care should be taken to protect the components and PCB from damage.
Product Details:
Payment & Shipping Terms:
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| Material: | FR-4 | Copper Thickness: | 1oz |
|---|---|---|---|
| Soldmask & Silkscreen: | Black & White | ||
| High Light: | FR4 PCB Electronic Circuit Board Assembly,SMT PCB Assembly 4 Layers,20um accuracy Multilayer PCBA Assembly |
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Features
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. Components procument
4.Components Assembly
5.Box building and testing
6. FR4 Material, Meet 94V0 standard
7. SMT, DIP technology suport
8. Lead Free HASL, Environmental Protection
9. UL, CE, ROHS Compliant
10. Shipping By DHL,UPS, TNT, EMS or Customer requirement
PCB&PCBA Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
Detail Specifications:
1/FR4 PCB#OEM #LCD Display#Electronic Circuit Board #Circuit Assembly#PCBA #Multilayer PCB Assembly#PCBA Testing
2/OEM/ODM,PCBA Manufacturing;Components sourcing&components Alessembly
3/Multilayer PCB#FR4 PCB#OEM# Electronic Circuit Board Assembly# SMT#DIP#Components assembly#PCBA Testing
4/SMT#DIP#AOI testing#X-Ray Testing# Printed Circuit Board#PCB Assembly#PCBA Testing#Box Building
5/FR4 PCB#Prototype Assembly#Small&Medium Volume&Hign Mixed#Quick-Turn#PCB Assembly#Double-sided Printed Circuit Board
6/Rigid-Flex Printed Circuit Board&Rigid Circuit Board# Multilayer Printed Circuit Board# ENIG / HASL/OSP# Surface treament.Components Sourcing#Components Assembly
7/TQFP-64 &TQFP-48 *TO DIP& FR4 HDI Printed Circuit Boards adapter Test Board
8/Gold Plating Multilayer Pinted Circuit Boards Standalone Access Controller Audio Extractor&NIAU Surfacce Treatment
KAZ Circuit has been operating as a manufacturer of PCB&PCBA since 2007. specialized in quick-turn manufacturing of prototypes and small to middle volume series of rigid, flex, rigid-flex and multilayer boards.
as well as aluminium substrate circuit board.we have a strong strength on fabrication of Roger board, MEGTRON MATERIAL board and 2&3 steps HDI boards and etc.
Beside with six SMT production lines and 2 DIP lines.we provide one-stop service to our customers as well.
Packing:Carton;P/P,Anti-static Bag.
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~30 layers |
| Material | FR-4, Aluminum, PI,MEGTRON MATERIAL |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg135~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
SMT PCB assembly refers to the process of manufacturing a printed circuit board (PCB) using surface mount technology, where electronic components are placed and soldered directly to the PCB surface rather than inserted through holes.
Key aspects of SMT PCB assembly include:
Component placement:
SMT components such as resistors, capacitors, integrated circuits (ICs) and other surface mount devices are placed directly on the PCB surface using automated pick and place machines.
Precise component placement is critical to ensure accurate alignment and reliable electrical connections.
Solder paste deposition:
Solder paste is a mixture of solder alloy particles and flux that is selectively deposited on the copper pads of a PCB using stencil printing or other automated processes.
Solder paste acts as an adhesive and conductive material that will form the electrical connection between the components and the PCB.
Reflow soldering:
After the components are placed, the PCB assembly goes through a reflow soldering process that heats the board in a controlled environment to melt the solder paste and form electrical and mechanical connections between the components and the PCB.
Reflow profiles including temperature, time and atmosphere are carefully optimized to ensure reliable solder joints.
Automatically detect:
After the reflow process, PCB assemblies are automatically inspected using a variety of techniques, such as optical inspection, X-ray inspection, or automated optical inspection (AOI).
These inspections help identify and correct any problems such as soldering defects, component misalignment or missing components.
Testing & Quality Control:
Comprehensive testing, including functional, electrical, and environmental testing, is performed to ensure that PCB assemblies meet required specifications and performance standards.
Implements quality control measures, such as statistical process control and failure analysis, to maintain high manufacturing standards and product reliability.
The advantages of SMT PCB assembly:
Higher Component Density: SMT components are smaller and can be placed closer together, resulting in a more compact, smaller PCB design.
Improved reliability: SMT solder joints are more resistant to vibration, shock and thermal cycling than through-hole connections.
Automated manufacturing: The SMT assembly process can be highly automated, increasing production efficiency and reducing manual labor.
Cost-Effectiveness: SMT assembly can be more cost-effective, especially for high-volume production, due to reduced material and labor costs.
SMT PCB assembly applications:
Consumer Electronics: Smartphones, Tablets, Laptops, and Other Portable Devices
Industrial electronics: control systems, automation equipment and power electronics equipment
Automotive electronics: engine control units, infotainment and safety systems
Aerospace and defense: avionics, satellite systems and military equipment
Medical devices: diagnostic equipment, implantable devices and portable healthcare solutions
SMT PCB assembly is a foundational technology used to produce compact, reliable, and cost-effective electronic devices in a variety of industries.
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Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059
