 |
|
Introduction：
Printed Circuit Board Assembly it to plug the SMT(Surface Mounted Technolofy) and the DIP in the Printed Circuit Board, also called PCBA.
Production：
Both SMT and DIP are means of integrating components in the PCB board. The main difference is that SMT does not need to drill holes on the PCB,while it's nacessary for the DIP to plug the pin of the component into the drilled hole.
SMT:
Mainly use the paste to pack machine to attach some micro components the PCB board. The production process is as follows: the PCB board positioning, solder paste printing, paste and pack, return to the soldering stove, finally inspection.
With the development of science and technology,SMT can also be applied to some large-size components.
DIP:
Insert the componets to the PCB. It is used as a mean to integrate components cause the size is too large to paste and pack, or the manufacturer's production process cannot use SMT technology.
At present, there are two ways to realize manual plug-in and robot plug-in.
The main production processes are as follows: paste back glue (to prevent tin plating to inappropriate places), plug-in, inspection, wave soldering, brush plate (to remove the stain left in the process of passing the furnace) and inspection
Product Details:
Payment & Shipping Terms:
|
| FR4: | TG135 | Layer: | 2L |
|---|---|---|---|
| Thickness: | 1.6mm | Top Finished Copper Thickness: | 1oz |
| Bottom Finished Copper Thickness: | 1oz | Surface Treatment: | HASL |
| Solder Mask: | Green | Silkscreen: | White |
| High Light: | 2L FR4 Printed Circuit Board,SMT PCBA Assembly 1.6mm,HASL Printed Circuit Board |
||
Description Of Printed Circuit Board Assembly Service
This product is a 2 layer FR4 printed circuit board assembly.it is used for industrial control application. we can accept PCBA prototype,samll volume, middle and large volume. no MOQ request for new order.all of our PCB and PCBA are met UL, TS16949,ROHS, ISO etc. certification.
Specification Of PCB Assembly Service
| 1 | Layer | 1-30 layer |
| 2 | Material | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum |
| 3 | Board thickness | 0.2mm-7mm |
| 4 | Max.finished board side | 510mm*1200mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | Min.line width | 0.075mm(3mil) |
| 7 | Min.line spaceing | 0.075mm(3mil) |
| 8 | Surface finish/treatment | HALS/HALS lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing, Plastic bag |
| 12 | Outer packing | Standard carton packing |
| 13 | Hole tolerance | PTH:±0.076, NTPH:±0.05 |
| 14 | Certificate | UL, ISO9001, ISO14001, ROHS, CQC |
| 15 | Profiling Punching | Routing, V-CUT, Beveling |
| 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
PCB Assembly(SMT) Product Capacity
| SMT Capacity | |
| SMT Item | Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Assembly capacity | ≥8 million piots/day |
| SMT capacity | 7 SMT production lines |
| DIP capacity | 2 DIP production lines |
| Assembly testing | Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test) |
FCT(Functional Circuit Test) |
Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement. |
Products Application:
1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense
8, Automotive
9, Industrial Automation
10, Medical Devices
11, New Energy
And so on
Advantage Of Printed Circuit Board Assembly Service
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
OEM/ODM/EMS Services For PCBA:
· PCBA, PCB Board assembly: SMT & PTH & BGA
· PCBA and enclosure design
· Components sourcing and purchasing
· Quick prototyping
· Plastic injection molding
· Metal sheet stamping
· Final assembly
· Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
· Custom clearance for material importing and product exporting
Now we have been a factory which can provide one-stop service,
from the PCB production, the components purchasing to the components assemble.
With more than 15 years of experience in PCB manufacturing and PCB assembly, KAZ Circuit provides flexible manufacturing options that adapt to cost targets, delivery requirements and fluctuating demands in volume.
Contact Person: Judy zhang
Tel: +8619892366687
