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| Brand Name: | KAZPCB |
| Model Number: | PCBA-J-001 |
| MOQ: | 1 |
| Price: | To be inquired |
| Supply Ability: | 100000 Units per monthes |
PCB with Assembly,
PCBA manufacturing service:
PCB files, PCB technical requirements, BOM, assembly or soldering technical requirements, to be offered by customer
One stop PCBA service: production of PCB from 1-32 layer, assembly components/material purchase, SMT production, PCBA testing, PCBA aging, PCBA packing, PCBA delivery
PCBA manufacturing quality
1. Certifications: CE-EMC, UL, FCC, SGS, RoHS Directive-compliant, ISO 9001:2008, ISO 14001:2004, TS16949
2. 8 dust-proof SMT lines and DIP lines
3. ESD and dust-proof working uniform implemented
4. Operators are strictly trained and approved for suitable working station
5. PCBA production equipment: Hitachi screen printer, FUJI NXT-II and FUJI XPF-L modules
Automatic solder-paste printer, reflow oven, wave solder machine, AI DIP machine
6. PCBA testing equipment: ORT machine, drop test machine, temperature and humidity test chamber, 3D CMM, RoHS Directive-compliant inspection machine, AOI, X-ray inspection
7. PCBA testing capability: AOI (automatic optic inspection), ICT (in-circuit test), FCT (functional circuit test), X-ray for BGAs
8. Component packing including component range: * 0201, 0402, 0603, 0805, 1206, 1608, 2125, 3216* fine pitch QFP to 0.2mm* BGA, flip chips, connectors* BGA to 0.2mm
9. SOP in every work station
10. PCB materials: FR4, CEM-3, FPC, ALUPCBA manufacturing delivery duration
Delivery for samples will be 10-15 WD after OEM contact is signed and engineering documents are confirmed
For mass production, based on the customer requirements, delivery can be done in several steps (partial delivery)
PCBA manufacturing
Additional information
1. After the confirmation of prototype, MP will be started
2. DIP components will be positioned only once, minimum distance between components and PCB board will be maintained
3. Positioning holes and grounding holes will be protected by high temperature resistance tape
4. EPE antistatic packing is used to prevent shock and other problems
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
