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Prototype PCB Assembly refers to making a small number of samples according to the circuit design or prototype before mass production to verify the correctness of the circuit design and the manufacturability of the product.
Prototype PCB Assembly plays a vital role in the product development process. First, it can help engineers find and correct potential problems in the design before actual production, thereby avoiding problems in mass production and saving costs and time. Secondly, proofing can also be used to test the performance and function of the product to ensure that the product can meet the design requirements. Finally, through Prototype PCB Assembly, manufacturers can build a bridge of communication with designers and customers to ensure that the final product can meet market demand.
Prototype PCB Assembly process
Circuit design: First, a complete circuit design drawing is required, which is the basis for Prototype PCB Assembly.
Material preparation: According to the circuit design drawing, prepare the required electronic components, printed circuit boards (PCBs) and other materials.
SMT patch: Use SMT (surface mount technology) to accurately mount electronic components on the PCB.
Welding and assembly: Complete the welding of electronic components and perform necessary assembly.
Functional test: Perform functional test on the PCBA board to ensure that it works properly.
Feedback and correction: Provide feedback based on the test results and correct problems in the design or production process.
Notes on Prototype PCB Assembly:
Design review: Before proofing, be sure to conduct a comprehensive review of the circuit design to ensure the correctness of the design.
Material selection: The selection of electronic components is crucial to the performance and stability of the product, so it is necessary to carefully select material suppliers.
Production process: The SMT patch process requires precise control to ensure that electronic components can be accurately mounted on the PCB.
Testing and verification: Perform comprehensive testing and verification on the sampled products to ensure that their performance and quality meet expectations.
Product Details:
Payment & Shipping Terms:
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| PCB Material: | FR4 | Components: | As Per Bom List |
|---|---|---|---|
| High Light: | quick turn printed circuit boards,prototype printed circuit board |
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PCBA manufacturing service:
PCB files, PCB technical requirements, BOM, assembly or soldering technical requirements, to be offered by customer
One stop PCBA service: production of PCB from 1-32 layer, assembly components/material purchase, SMT production, PCBA testing, PCBA aging, PCBA packing, PCBA delivery
PCBA manufacturing quality
1. Certifications: CE-EMC, UL, FCC, SGS, RoHS Directive-compliant, ISO 9001:2008, ISO 14001:2004, TS16949
2. 8 dust-proof SMT lines and DIP lines
3. ESD and dust-proof working uniform implemented
4. Operators are strictly trained and approved for suitable working station
5. PCBA production equipment: Hitachi screen printer, FUJI NXT-II and FUJI XPF-L modules
Automatic solder-paste printer, reflow oven, wave solder machine, AI DIP machine
6. PCBA testing equipment: ORT machine, drop test machine, temperature and humidity test chamber, 3D CMM, RoHS Directive-compliant inspection machine, AOI, X-ray inspection
7. PCBA testing capability: AOI (automatic optic inspection), ICT (in-circuit test), FCT (functional circuit test), X-ray for BGAs
8. Component packing including component range: * 0201, 0402, 0603, 0805, 1206, 1608, 2125, 3216* fine pitch QFP to 0.2mm* BGA, flip chips, connectors* BGA to 0.2mm
9. SOP in every work station
10. PCB materials: FR4, CEM-3, FPC, ALUPCBA manufacturing delivery duration
Delivery for samples will be 10-15 WD after OEM contact is signed and engineering documents are confirmed
For mass production, based on the customer requirements, delivery can be done in several steps (partial delivery)
PCBA manufacturing
Additional information
1. After the confirmation of prototype, MP will be started
2. DIP components will be positioned only once, minimum distance between components and PCB board will be maintained
3. Positioning holes and grounding holes will be protected by high temperature resistance tape
4. EPE antistatic packing is used to prevent shock and other problems
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
Contact Person: Stacey Zhao
Tel: +86 13392447006
Fax: 86-755-85258059
