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What it is:
Any PCB Board with more than 2 layers can be called Multilayer PCB Board .
Multilayer PCB Board includes multi-layer etch layers and medium layers between each two etch layers.The medium layer can be very thin. There are at least three conductive layer in a multilayer circuit board , two of which are outlayers, while the remaining one is synthesized inside the insulation board.
The electrical connection between them is usually achieved through the plating hole in the cross section of the circuit board.
Classify: Multilayer rigid board, multilayer flexible board and multilayer rigid-flex board.
Why we need it:
Cause the increased concentration of integrated circuit package leading to a high concentration of interconnect lines, It makes it necessory to use the multiple substrates.
Unpredictable design issues such as noise, stray capacitance, crosstalk, etc. occur in the layout of the PCB. Therefore, the design of PCB must focus on minimizing the length of the signal line and avoiding parallel paths.
Obviously, due to the limited number of crossovers that can be achieved in a single-side, even in a double-side board, these requirements cannot be satisfied.
In the case of a large number of requirements in interconnections and crossovers, to achieve a satisfactory performance, the board must be expanded to more than two layers, so a multilayer PCB board is manufactured.
Product Details:
Payment & Shipping Terms:
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PCB Material: | FR4 | Spec: | As Per Customer Gerber Files |
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Layer: | 2 | Soldmark: | EING |
Material: | FR4 | Copper: | 2OZ |
High Light: | custom printed circuit board,pcb printed circuit board |
PCB board
Layer: 1-16
Material: FR4 laminate, RoHS Directive-compliant
PCB thickness: 0.4-6.0mm
Final copper: 0.5-6oz
Min hole: 0.2mm
Min line width/space: 3/3 mil
Min hole copper: 20/25µm
Solder masks: green/blue/red/black/gray/white
Legend: white/black/yellow
Surface: OSP/HAL lead-free/immersion gold/immersion tin/immersion silver/flash gold/hard gold
Outline: rout and score/V-cut
E-test: 100%
Inspection standard: IPC-A-600H/IPC-6012B, class 2/3
Outgoing reports: final inspection, e-test, solderability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant, ISO/TS16949:2009
Manufacturer Capacity:
Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
Board Thickness | 0.3~4.0mm |
Layers | 1~20 layers |
Material | FR-4, Aluminum, PI |
Copper Thickness | 0.5~4oz |
Material Tg | Tg140~Tg170 |
Max PCB Size | 600*1200mm |
Min Hole Size | 0.2mm (+/- 0.025) |
Surface Treatment | HASL, ENIG, OSP |
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059