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HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.
This is a circuit board that uses micro-blind buried hole technology, with very high line density and complexity, and can achieve high-speed signal transmission and reliability design. The main features of HDI circuit boards are multi-layer lines, thin plates, small apertures, dense wiring and fine lines, and are widely used in mobile phones, computers, network communications, automotive electronics and other fields.
The manufacture of HDI circuit boards is one of the fastest-growing areas in the printed circuit board industry. It is a compact product designed for small-capacity users. As electronic products develop towards high density and high precision, HDI circuit boards have put forward the same requirements accordingly. The production of HDI boards uses advanced fine line production technology, so that the line width and spacing reach the micron level. This high-precision line layout not only improves the performance of the circuit board, but also reduces energy consumption and electromagnetic interference. Therefore, HDI circuit boards are widely used in high-end electronic devices such as smartphones, tablets, and laptops.
In the manufacturing process of HDI circuit boards, the process of drilling and metallization in the holes is used to achieve the connection function between the lines of each layer. Compared with traditional multi-layer circuit boards, HDI circuit boards adopt the build-up method, use blind and buried vias to reduce the number of through holes, save the PCB wiring area, and thus greatly increase the density of components. Therefore, they have quickly replaced the original multi-layer boards in the use of smart phones. With the continuous advancement of electronic technology, electronic products continue to develop in the direction of light, thin, short and small, and high-density interconnect (HDI) technology has come into being.
Product Details:
Payment & Shipping Terms:
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PCB Material: | FR4 | Size: | As Per Gerber |
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Thickness: | 0.8-3.2mm | Layers: | 4-10layers |
Copper: | 1OZ | Surface: | ENIG/HASL/OSP |
Soldermask: | Red/Green/Black/White | Standard: | IPC Class 2 |
Silkscreen: | White/Black | ||
Highlight: | blind via pcb,hdi pcb |
4-10 layers FR4 1OZ ENIG/HASL/OSP HDI Printed Circuit Boards With Blind&Burried holes
Detail Specifications:
Layers | 4-10Layers |
Material | FR-4 |
Board Thickness | 1.6mm |
Copper Thickness | 1oz |
Surface Treatment | ENIG/HASL/OSP |
Soldmask & Silkscreen | Green & White |
Quality Standard | IPC Class 2, 100% E-testing |
Certificates | TS16949, ISO9001, UL, RoHS |
Photoes of this 4-10 layers FR4 1OZ ENIG/HASL/OSP HDI Printed Circuit Boards With Blind&Burried holes
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
Company Informaiton:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
Manufacturer Capacity:
Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
Board Thickness | 0.3~4.0mm |
Layers | 1~20 layers |
Material | FR-4, Aluminum, PI |
Copper Thickness | 0.5~4oz |
Material Tg | Tg140~Tg170 |
Max PCB Size | 600*1200mm |
Min Hole Size | 0.2mm (+/- 0.025) |
Surface Treatment | HASL, ENIG, OSP |
Contact Person: Stacey Zhao
Tel: +86 13392447006
Fax: 86-755-85258059