|
1. Introduction
The assembly of the printing plate is based on the requirements of the design documents and process specifications, and the electronic components are inserted into the printed circuit board according to a certain regularity, and the assembly process is fixed by fasteners or soldering.
2.Specification
Type | SMT |
Base material | Copper |
Flame retardant properties | VO |
Item number | PCB Manufacturer |
Brand | PCBA circuit board electronic component assembly |
Layer | 2 |
Customized | Yes |
Processing technology | Electrolytic foil |
3. Application
PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology. However, multilayer PCBs make repair, analysis, and field modification of circuits much more difficult and usually impractical.
Product Details:
Payment & Shipping Terms:
|
Product Name: | PCBA | Place Of Origin: | Guangdong , China |
---|---|---|---|
Min. Line Spacing: | 3 Mil (0.075 Mm) | Min. Hole Size: | 3mil (0.075mm) |
Brand Name: | OEM | Components Purchasing: | OK |
SMT DIP Assembly: | Support | Type: | SMT Assembly |
Highlight: | pcb board assembly,pcb prototype assembly |
High Current Power Battery Pcb Board Assembly L279*W200*T38mm 1-30s Pcm Li Ion 48v 200
1. Features
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. FR4 Material, Meet 94V0 standard
4. SMT, DIP technology suport
5. Lead Free HASL, Environmental Protection
6. UL, CE, ROHS Compliant
7. Shipping By DHL,UPS, TNT, EMS or Customer requirement
2. PCBA Technical capability
SMT | Position accuracy:20 um |
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max. component height::25mm | |
Max. PCB size:680×500mm | |
Min. PCB size:no limited | |
PCB thickness:0.3 to 6mm | |
PCB weight:3KG | |
Wave-Solder | Max. PCB width:450mm |
Min. PCB width: no limited | |
Component height:Top 120mm/Bot 15mm | |
Sweat-Solder | Metal type :part, whole, inlay, sidestep |
Metal material:Copper , Aluminum | |
Surface Finish:plating Au, plating sliver , plating Sn | |
Air bladder rate:less than20% | |
Press-fit | Press range:0-50KN |
Max. PCB size:800X600mm | |
Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
2. PCBA Pictures
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059