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1. Introduction for Electronic Printed Circuit Board
A printed circuit board is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing, it is called a "printing" circuit board.
2. Specification for Electronic Printed Circuit Board
| Material | FR4; Megtron; Arlon; Nelco |
| Layer | 2-20L |
| Copper | 0.5-3oz |
| Surface Treatment | HASL;ENIG |
| Soldermask | Black; Red; Green;White |
| Silkscreen | White, Black |
| Board Thickness | 1.6mm |
3.Process for Electronic Printed Circuit Board
Opening ------ Inner layer ----- lamination----drilling---sinking copper----line--- diagram electric----etching-----resistance welding ---character----spray tin (or immersion gold)-锣 edge-v cut (part of the PCB is not needed)-----fly test----vacuum packaging
4. Characteristics for Electronic Printed Circuit Board
PCBs are becoming more widely used because they have many unique advantages, as outlined below.
Can be high density. For decades, the high density of printed boards has grown with the integration of integrated circuits and advances in mounting technology.
1.High reliability. Through a series of inspections, tests and aging tests, the PCB can be reliably operated for a long period of time (usually 20 years).
Designability. For the various performances of PCB (electrical, physical, chemical, mechanical, etc.), the design of printed boards can be realized through design standardization and standardization, with short time and high efficiency.
2.Productivity. With modern management, it can standardize, scale (quantify), automate and other production, and ensure product quality consistency.
3.Testability. Established relatively complete test methods, test standards, various test equipment and instruments to detect and identify PCB product qualification and service life.
4. Assemblyability. PCB products not only facilitate the standardized assembly of various components, but also can be automated, large-scale mass production. At the same time, the PCB and various component assembly components can be assembled to form larger components and systems up to the complete machine.
5. Maintainability. Since PCB products and various component assembly components are produced in a standardized design and scale, these components are also standardized. Therefore, once the system fails, it can be replaced quickly, conveniently and flexibly, and the system can be quickly restored. Of course, you can say more about it. Such as miniaturization and weight reduction of the system, high-speed signal transmission, and the like.
Product Details:
Payment & Shipping Terms:
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| Layer Count: | 2 ` 30 Layers | Max Board Size: | 600 Mm X 1200 Mm |
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| Base Material For PCB: | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material | Rang Of Finish Baords Thickness: | 0.21-7.0mm |
| Minimum Line Width: | 3mil (0.075mm) | Minimum Line Space: | 3mil (0.075mm) |
| Minimum Hole Diameter: | 0.10 Mm | Finishing Treatment: | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, Etc. |
| Thickness Of Copper: | 0.5-14oz (18-490um) | E-Testing: | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| High Light: | electronics circuit board,flex pcb prototype |
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Gold Plating Surface Finishing Electronic Board Assembly Multilayer Circuit Board
1. Features of Circuit Board
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. FR4 Material, Meet 94V0 standard
4. SMT, DIP technology suport
5. Lead Free HASL, Environmental Protection
6. UL, CE, ROHS Compliant
7. Shipping By DHL,UPS, TNT, EMS or Customer requirement
2. Circuit board Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
Printed circuit boards (PCBs) are the basic components of electronic equipment and are the physical foundation that connects and supports various electronic components. It plays a vital role in the functionality and reliability of electronic systems.
Key aspects of electronic printed circuit boards include:
Layers and composition:
PCBs are typically made up of multiple layers, with the most common being a 2- or 4-layer design.
These layers are made of copper serving as conductive paths and a non-conductive substrate such as fiberglass (FR-4) or other specialty materials.
Other layers may include power and ground planes for power distribution and noise reduction.
Interconnects and Traces:
The copper layer is etched to form conductive traces that serve as pathways for electrical signals and power.
Vias are plated-through holes that connect traces between different layers, enabling multi-layer interconnections.
Trace width, spacing, and routing patterns are designed to optimize signal integrity, impedance, and overall electrical performance.
Electronic component:
Electronic components, such as integrated circuits, resistors, capacitors, and connectors, are mounted and soldered to the PCB.
The placement and routing of these components is critical to ensuring optimal performance, cooling, and overall system functionality.
PCB manufacturing technology:
PCB manufacturing processes typically involve steps such as lamination, drilling, copper plating, etching and solder mask application.
Advanced technologies such as laser drilling, advanced plating, and multi-layer co-lamination are used in specialized PCB designs.
PCB Assembly & Soldering:
Electronic components are placed and soldered onto the PCB either manually or automatically using techniques such as through-hole soldering or surface mount soldering.
Reflow soldering and wave soldering are common automated processes for connecting components.
Testing & Quality Control:
The PCB undergoes various testing and inspection processes such as visual inspection, electrical testing, and functional testing to ensure its reliability and performance.
Quality control measures, such as in-process inspections and design-for-manufacturability (DFM) practices, help maintain high standards in PCB production.
Electronic PCBs are used in a wide variety of applications, including consumer electronics, industrial equipment, automotive systems, medical devices, aerospace and telecommunications equipment, and more. Continuing advances in PCB technology, such as the development of high-density interconnect (HDI) PCBs and flexible PCBs, have enabled the creation of smaller, more powerful, and more energy-efficient electronic devices.
2. Circuit Board Pictures
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059
