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HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.
It uses the micro blind & buried vias technology with high density circuits layout on the PCB board. It's a compact PCB that is designed for small volume users. It uses the design of modular paralle capacity of 1000VA, say height of 1u, natural cooling down, and it can be placed into the rack of 19" directly, the max parallel that can be connected in is up to 6 modules. This special products uses all digital signal processing (DSP) technology and multiple patented technology, it has the ful range of adaptability to load capacity and strong short-term overload capacity, and can ignore the factor of load power and crest.
Advantages of HDI PCB can be small size, high frequency and high speed. Mainly used for PC, cellphones and digital cameras...
Product Details:
Payment & Shipping Terms:
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| Layer Count: | 1 ~ 30 Layers | Max Board Size: | 600 Mm X 1200 Mm |
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| Base Material For PCB: | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material | Minimum Line Width: | 3mil (0.075mm) |
| Minimum Line Space: | 3mil (0.075mm) | Minimum Hole Diameter: | 0.10 Mm |
| High Light: | blind via pcb,lead free pcb |
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Controller Outstanding Rigid Aluminium Based PCB
PCB Capabilities:
Rigid PCB up to 30 layers
Flexible PCB up to 6 layers
Rigid flex PCB up to 20 layers
Metal based PCB up to 8 layers
Material : FR4, high TG FR4, Halogen free FR4, high frequency, ceramic,aluminum copper based, polyimide
Surface finish: HAL, lead free HAL, immersion gold, silver, tin, OSP, hard gold plating, ENEPIG, carbon ink, blue mask
DHI technology: 1+n+1,1+1+n+1+1,2+n+2,3+n+3, stacked vias available
Other special technology: conductively (or non-conductively) via filling, edge plating, back drill, heavy copper (up to 14oz), via in PAD filling, extreme large or thick PCB, microwave and RF circuit boards
Competitive Advantage:
Description :
| Layer: | 1 layer-30 layers |
| Board thickness: | 0.2mm-6.0mm |
| Copper thickness: | 0.5oz-6.0 oz |
| Max board size : | 600 x 1200mm |
| Min. hole diameter: | 0.1mm |
| Min. line width: | 0.075mm |
| file format: | pcb,doc,ddb etc |
| MOQ: | 1 piece |
| Base material: | FR-4,TG, CEM-1, CEM-3, Aluminium,94V0, 94HB |
| Solder mask & Silkscreen: | green, red, blue, yellow, black, white etc |
| Surface finish: | ENIG, ImAg, ImSn, OSP, HASL, lead free,immersion gold,Gold-plate etc |
Pictures :
Contact Person: Stacey Zhao
Tel: +86 13392447006
