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HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.
It uses the micro blind & buried vias technology with high density circuits layout on the PCB board. It's a compact PCB that is designed for small volume users. It uses the design of modular paralle capacity of 1000VA, say height of 1u, natural cooling down, and it can be placed into the rack of 19" directly, the max parallel that can be connected in is up to 6 modules. This special products uses all digital signal processing (DSP) technology and multiple patented technology, it has the ful range of adaptability to load capacity and strong short-term overload capacity, and can ignore the factor of load power and crest.
Advantages of HDI PCB can be small size, high frequency and high speed. Mainly used for PC, cellphones and digital cameras...
Product Details:
Payment & Shipping Terms:
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| Layer Count: | 2 ` 30 Layers | Max Board Size: | 600 Mm X 1200 Mm |
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| Base Material For PCB: | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material | Rang Of Finish Baords Thickness: | 0.21-7.0mm |
| Minimum Line Width: | 3mil (0.075mm) | Minimum Line Space: | 3mil (0.075mm) |
| Minimum Hole Diameter: | 0.10 Mm | Finishing Treatment: | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, Etc. |
| Thickness Of Copper: | 0.5-14oz (18-490um) | E-Testing: | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| High Light: | lead free pcb,hdi pcb |
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Multilayer PCBs Manufcturer Multilayer Printed Circuit Board Fabrication
1. Features
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. FR4 Material, Meet 94V0 standard
4. SMT, DIP technology suport
5. Lead Free HASL, Environmental Protection
6. UL, CE, ROHS Compliant
7. Shipping By DHL,UPS, TNT, EMS or Customer requirement
2. PCB Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
2. PCB Pictures
Contact Person: Mrs. Helen Jiang
Tel: 86-18118756023
Fax: 86-755-85258059
