The R&D for electronic products, such as CB design, program design, PSI simulation, EMC design, ID design, structural design, etc.
The design of the printed circuit board is based on the circuit schematic diagram to achieve the functions required by the circuit designer. The design of the printed circuit board mainly refers to the layout design, and the layout of the external connection needs to be considered. Optimized layout of internal electronic components. Optimized layout of metal wiring and vias. Electromagnetic protection. Various factors such as heat dissipation. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation. Simple layout designs can be implemented manually, and complex layout designs need to be implemented with computer-aided design (CAD).
Payment & Shipping Terms:
|Layers:||8 Layers||Board Thickness:||1.6mm|
pcb board design,
electronic board design
HDI Printed Circuit Board Assembly 8 Layers with impedance control
|Board Thickness||1.6 mm|
|Soldmask & Silkscreen||Green|
|Quality Standard||IPC Class 2, 100% E-testing|
|Certificates||TS16949, ISO9001, UL, RoHS|
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!
|Capacity||Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
|Min Line Width/Gap||4/4 mil (1mil=0.0254mm)|
|Material||FR-4, Aluminum, PI|
|Max PCB Size||600*1200mm|
|Min Hole Size||0.2mm (+/- 0.025)|
|Surface Treatment||HASL, ENIG, OSP|
Photoes of this HDI Printed Circuit Board Assembly 8 Layers For Mobile Phone Cell Phone with impedance control
Contact Person: Jesson