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FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA

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HDI Printed Circuit Boards

  • High Precision HDI Printed Circuit Boards suppliers

HDI PCB is the shortened form of High Density Interconnector PCB. It's a technology of printed circuit board production.

 

This is a circuit board that uses micro-blind buried hole technology, with very high line density and complexity, and can achieve high-speed signal transmission and reliability design. The main features of HDI circuit boards are multi-layer lines, thin plates, small apertures, dense wiring and fine lines, and are widely used in mobile phones, computers, network communications, automotive electronics and other fields.


The manufacture of HDI circuit boards is one of the fastest-growing areas in the printed circuit board industry. It is a compact product designed for small-capacity users. As electronic products develop towards high density and high precision, HDI circuit boards have put forward the same requirements accordingly. The production of HDI boards uses advanced fine line production technology, so that the line width and spacing reach the micron level. This high-precision line layout not only improves the performance of the circuit board, but also reduces energy consumption and electromagnetic interference. Therefore, HDI circuit boards are widely used in high-end electronic devices such as smartphones, tablets, and laptops.


In the manufacturing process of HDI circuit boards, the process of drilling and metallization in the holes is used to achieve the connection function between the lines of each layer. Compared with traditional multi-layer circuit boards, HDI circuit boards adopt the build-up method, use blind and buried vias to reduce the number of through holes, save the PCB wiring area, and thus greatly increase the density of components. Therefore, they have quickly replaced the original multi-layer boards in the use of smart phones. With the continuous advancement of electronic technology, electronic products continue to develop in the direction of light, thin, short and small, and high-density interconnect (HDI) technology has come into being. ‌

FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA

FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA
FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA

Large Image :  FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA

Product Details:

Place of Origin: Shenzhen China
Brand Name: KAZPCB
Certification: IATF16949-2016 | ISO9001 2015 | UL 337072 | ROHS
Model Number: PCB-HDI-113

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: To be Inquired
Packaging Details: vacuum bag
Delivery Time: 12-15days
Payment Terms: T/T, L/C
Supply Ability: 10000pcs/month
Detailed Product Description
PCB Material: FR4 Spec: As Per Customer Gerber Files
Size: As Per Gerber File Thickness: 0.8-3.2mm
Layers: 4-30layers Surface Treatment: ENIG&OSP&HASL
Solder Mask: Green&Green&Red&White Standard: IPC Class 2
Gold Finger: Yes HDI: Yes
Highlight:

blind via pcb

,

hdi pcb

PCB board
Layer: 4-16
Material: FR4 laminate, RoHS Directive-compliant
PCB thickness: 0.4-6.0mm
Final copper: 0.5-6oz
Min hole: 0.1mm
Min line width/space: 3/3 mil
Min hole copper: 20/25µm
Solder masks: green/blue/red/black/gray/white
Legend: white/black/yellow
Surface: OSP/HAL lead-free/immersion gold/immersion tin/immersion silver/flash gold/hard gold
Outline: rout and score/V-cut
E-test: 100%
Inspection standard: IPC-A-600H/IPC-6012B, class 2/3
Outgoing reports: final inspection, e-test, solderability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant, ISO/TS16949:2009

 

Manufacturer Capacity:
 

Capacity Double Sided: 12000 sq.m / month
Multilayers: 8000sq.m / month
Min Line Width/Gap 4/4 mil (1mil=0.0254mm)
Board Thickness 0.3~4.0mm
Layers 1~20 layers
Material FR-4, Aluminum, PI
Copper Thickness 0.5~4oz
Material Tg Tg140~Tg170
Max PCB Size 600*1200mm
Min Hole Size 0.2mm (+/- 0.025)
Surface Treatment HASL, ENIG, OSP

 

FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA  FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA FR4 Material 3layer 2OZ 2U'' HASL/ENIG surface green/blue soldermask HDI Pcb Blind Holes Impedance Control BGA

Contact Details
Shenzhen KAZ Circuit Co., Ltd

Contact Person: Mrs. Helen Jiang

Tel: 86-18118756023

Fax: 86-755-85258059

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