Introduction：

Printed Circuit Board Assembly is to plug the SMT(Surface Mounted Technolofy) and the DIP in the Printed Circuit Board, also called PCBA.

Production：

Both SMT and DIP are means of integrating components in the PCB board. The main difference is that SMT does not need to drill holes on the PCB,while it's nacessary for the DIP to plug the pin of the component into the drilled hole.

SMT:

Mainly use the paste to pack machine to attach some micro components the PCB board. The production process is as follows: the PCB board positioning, solder paste printing, paste and pack, return to the soldering stove, finally inspection.

With the development of science and technology,SMT can also be applied to some large-size components.

DIP:

Insert the componets to the PCB. It is used as a mean to integrate components cause the size is too large to paste and pack, or the manufacturer's production process cannot use SMT technology.

At present, there are two ways to realize manual plug-in and robot plug-in.

The main production processes are as follows: paste back glue (to prevent tin plating to inappropriate places), plug-in, inspection, wave soldering, brush plate (to remove the stain left in the process of passing the furnace) and inspection

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